UDC 621.3.049.77.001

Method for thin-film micromodule topology design having components of 10 to 50 µm dimensions

Spirin V. G.

The discussed method enables to design the thin-film components having minimum dimensions of 10 to 50 µm. The micromodule integration enhancement is obtained due to the compensation for systematic errors of thin-film components structural parameters; modification of algorithm for resistors dimensional computation; through optimization of components and resistors layout.

Russia, Arzamas, «Temp-Avia» SPO.